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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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ON Semiconductor |
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.6V V8.65mm mmLead Free
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798 |
24-SSOP (0.154, 3.90mm Width) |
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Maxim Integrated |
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
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430 |
SOT-23-8 |
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NXP USA Inc. |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
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557 |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
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STMicroelectronics |
8-WFDFN Exposed Pad Thermal Management
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996 |
8-WFDFN Exposed Pad |
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Texas Instruments |
24-WFQFN Exposed Pad Thermal Management Contains Lead
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654 |
24-WFQFN Exposed Pad |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management
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795 |
8-WFDFN Exposed Pad |
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Microchip Technology |
8-UFDFN Exposed Pad Thermal Management
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568 |
8-UFDFN Exposed Pad |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management Lead Free
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987 |
16-SSOP (0.154, 3.90mm Width) |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management
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429 |
16-SSOP (0.154, 3.90mm Width) |
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ON Semiconductor |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management Lead Free
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739 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management 3.3V VLead Free
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780 |
8-WFDFN Exposed Pad |
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ON Semiconductor |
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V VLead Free
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465 |
24-SSOP (0.154, 3.90mm Width) |
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STMicroelectronics |
8-WFDFN Exposed Pad Thermal Management Lead Free
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245 |
8-WFDFN Exposed Pad |
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Renesas Electronics America Inc. |
8-VFDFN Exposed Pad Thermal Management
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311 |
8-VFDFN Exposed Pad |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management Lead Free
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776 |
8-WFDFN Exposed Pad |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V7.8mm mmLead Free
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723 |
24-TSSOP (0.173, 4.40mm Width) |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
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976 |
24-TSSOP (0.173, 4.40mm Width) |
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Linear Technology/Analog Devices |
16-TFSOP (0.118, 3.00mm Width) Thermal Management 4.039mm mm
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410 |
16-TFSOP (0.118, 3.00mm Width) |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
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427 |
8-WFDFN Exposed Pad |
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Analog Devices Inc. |
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
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462 |
14-CDIP (0.300, 7.62mm) |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
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404 |
8-WFDFN Exposed Pad |
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Linear Technology/Analog Devices |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3mm mm
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532 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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137 |
48-LQFP |
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Maxim Integrated |
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mmLead Free
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394 |
8-SOIC (0.154, 3.90mm Width) |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
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468 |
24-TSSOP (0.173, 4.40mm Width) |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
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429 |
24-TSSOP (0.173, 4.40mm Width) |
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Maxim Integrated |
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
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162 |
16-SSOP (0.154, 3.90mm Width) |
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Analog Devices Inc. |
TO-100-10 Metal Can Thermal Management 9.4mm mmContains Lead
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769 |
TO-100-10 Metal Can |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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315 |
48-LQFP |
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Maxim Integrated |
16-SSOP (0.154, 3.90mm Width) Thermal Management
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968 |
16-SSOP (0.154, 3.90mm Width) |
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