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Integrated Circuits (ICs)

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Part Number
Manufacturers
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In Stock
Packing
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ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.6V V8.65mm mmLead Free
798
24-SSOP (0.154, 3.90mm Width)
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
430
SOT-23-8
NXP USA Inc.
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
557
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
STMicroelectronics
8-WFDFN Exposed Pad Thermal Management
996
8-WFDFN Exposed Pad
Texas Instruments
24-WFQFN Exposed Pad Thermal Management Contains Lead
654
24-WFQFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management
795
8-WFDFN Exposed Pad
Microchip Technology
8-UFDFN Exposed Pad Thermal Management
568
8-UFDFN Exposed Pad
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management Lead Free
987
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management
429
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management Lead Free
739
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Microchip Technology
8-WFDFN Exposed Pad Thermal Management 3.3V VLead Free
780
8-WFDFN Exposed Pad
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V VLead Free
465
24-SSOP (0.154, 3.90mm Width)
STMicroelectronics
8-WFDFN Exposed Pad Thermal Management Lead Free
245
8-WFDFN Exposed Pad
Renesas Electronics America Inc.
8-VFDFN Exposed Pad Thermal Management
311
8-VFDFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management Lead Free
776
8-WFDFN Exposed Pad
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V7.8mm mmLead Free
723
24-TSSOP (0.173, 4.40mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
976
24-TSSOP (0.173, 4.40mm Width)
Linear Technology/Analog Devices
16-TFSOP (0.118, 3.00mm Width) Thermal Management 4.039mm mm
410
16-TFSOP (0.118, 3.00mm Width)
NXP USA Inc.
8-WFDFN Exposed Pad Thermal Management
427
8-WFDFN Exposed Pad
Analog Devices Inc.
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
462
14-CDIP (0.300, 7.62mm)
NXP USA Inc.
8-WFDFN Exposed Pad Thermal Management
404
8-WFDFN Exposed Pad
Linear Technology/Analog Devices
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3mm mm
532
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Linear Technology/Analog Devices
48-LQFP Thermal Management
137
48-LQFP
Maxim Integrated
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mmLead Free
394
8-SOIC (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
468
24-TSSOP (0.173, 4.40mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
429
24-TSSOP (0.173, 4.40mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
162
16-SSOP (0.154, 3.90mm Width)
Analog Devices Inc.
TO-100-10 Metal Can Thermal Management 9.4mm mmContains Lead
769
TO-100-10 Metal Can
Linear Technology/Analog Devices
48-LQFP Thermal Management
315
48-LQFP
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management
968
16-SSOP (0.154, 3.90mm Width)