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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V
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809 |
256-LBGA |
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Microsemi Corporation |
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O
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488 |
896-BGA |
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Microsemi Corporation |
288 Terminations-40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 28, FPGA - 68 I/O1.5V Min 1.425V VMax 1.575V V
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804 |
288-TFBGA, CSPBGA |
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Microsemi Corporation |
208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V
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340 |
208-BFQFP |
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Xilinx Inc. |
0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O
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717 |
676-BBGA, FCBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V
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532 |
256-LBGA |
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Intel |
0°C~100°C TJ System On ChipStratix? 10 SX Series
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198 |
2397-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V
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286 |
256-LBGA |
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Xilinx Inc. |
0°C~85°C TJ XC7Z020 System On ChipZynq?-7000 Series 130 I/O
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742 |
484-LFBGA, CSPBGA |
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Microsemi Corporation |
0°C~85°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 28, FPGA - 68 I/O
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634 |
288-TFBGA, CSPBGA |
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Xilinx Inc. |
0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O
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215 |
900-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ 288 Pin A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/OMin 1.425V VMax 1.575V V
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921 |
288-TFBGA, CSPBGA |
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Intel |
-40°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O
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986 |
2397-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S010S System On ChipSmartFusion?2 Series 195 I/O
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311 |
400-LFBGA |
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Xilinx Inc. |
0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O
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713 |
900-BBGA, FCBGA |
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Microsemi Corporation |
0°C~85°C TJ M2S100T System On ChipSmartFusion?2 Series 574 I/O1.2V
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724 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S150S System On ChipSmartFusion?2 Series 574 I/O
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617 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S150S System On ChipSmartFusion?2 Series 574 I/O
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813 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O
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315 |
256-LBGA |
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Microsemi Corporation |
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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917 |
144-LQFP |
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Microsemi Corporation |
-40°C~100°C TJ M2S100T System On ChipSmartFusion?2 Series 574 I/O1.2V
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395 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ 325 Pin System On ChipSmartFusion?2 Series 200 I/O1.2V
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407 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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748 |
400-LFBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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621 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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877 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S025TS System On ChipSmartFusion?2 Series 207 I/O
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701 |
400-LFBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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915 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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796 |
484-BGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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129 |
676-BGA |
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Intel |
-40°C~100°C TJ System On ChipCyclone? V SE Series MCU - 151, FPGA - 66 I/O
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773 |
484-FBGA |
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